doc. no : qw0905-LG32240 rev. : a date : 03 - jan - 2005 data sheet round t ype led lamps LG32240 ligitek electronics co.,ltd. property of ligitek only
25.0min 0.5 typ 1.0min 0 x 0 note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. -60 x 100% 75% 50% 25% directivity radiation -30 x 2.54typ 60 x 25% 50% 100% 75% 30 x 4.6 4.05 5.0 6.0 ligitek electronics co.,ltd. property of ligitek only part no. LG32240 package dimensions 1.5max page 1/4
-40 ~ +100 tstg storage temperature max 260 j for 5 sec max (2mm from body) typical electrical & optical characteristics (ta=25 j ) forward voltage @20ma(v) max. spectral halfwidth ??f nm peak wave length f pnm part no material green diffused note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. gap LG32240 green emitted 565 lens 30 1.7 min. color soldering temperature tsol luminous intensity @10ma(mcd) viewing angle 2 c 1/2 (deg) min. 2.6 12 25 typ. 54 j ligitek electronics co.,ltd. property of ligitek only part no. LG32240 absolute maximum ratings at ta=25 j forward current operating temperature reverse current @5v power dissipation peak forward current duty 1/10@10khz parameter 30 i f t opr ir pd i fp -40 ~ +85 10 100 120 symbol ratings g page 2/4 ma j g a ma mw unit
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) page forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip part no. LG32240 fig.6 directive radiation 3/4
this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. this test intended to see soldering well performed or not. high temperature high humidity test solder resistance test thermal shock test solderability test 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. ligitek electronics co.,ltd. property of ligitek only part no. LG32240 operating life test low temperature storage test high temperature storage test reliability test: test item 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) test condition page 4/4 reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 description
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